Partnership between SUSS MicroTec and SET to develop a combined equipment solution for 3D chip integration

SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and SET will provide a fully automated, customizable, highest-yield equipment solution to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked […]